Multi-Target Sputtering System

Manufacturer Name/Country – Custom Made Indigenously Item @ IIT-Mandi and partially designed by Advanced Process Technology Pvt. Ltd (India)

Model Name- Self Assembled

( Lab-4)

Product Specification/Description:  

  • Number of Target Nine (9)
  • 3 Chamber C1- For Oxide, 3 Chamber C2- For Metal, 3 Chamber C3- For Parallel
  • Turbo Molecular Pump (STPiX455C): Pumping speed for N2 and H2 is 300 l/s, Max. working pressure is 1.3 x 10-1Pa,  Rated speed 55,000 rpm, Vacuum range upto 8.0E-7 Storage temperature range is -25 to 55 °C
  • Rotary Pump: Vacuum range upto 5.0E-3
  • RF 13.6 MHz for oxide metal chamber and DC 600 watt for sputtering metal
  • SS Spherical chamber 14 to 16” dia, 3 sputter sources in confocal and sputter down configuration ( CF flange)
  • Capable of rotation and heating a sample to 800 oC
  • N type female RF connector, Shutter to be UHV compatible
  • Pneumatic valve to isolate the pump (CF 150 flange) and gas inlets.
  • Below sealed roughing valve and backing valve (Electroneumatic)
  • Pirani gauge, Sample holder for heating 6” dia. sample to 800 oC
  • Mass Flow Controllers
  • Integrated with Plasma Enhanced Chemical Vapor Deposition (PECVD)